Heatsink is a kind of device used to conduct and release heat in all kinds of electronic components and electrical appliances. At present, heatsinks mainly have electric heating radiator, computer heat sink and car heat sink and so on. And according to different materials and work modes, heatsinks can be divided into several types, and the computer heat sink can also be divided into several types depending on the application and installation methods, this is true for the auto heat sinks. The materials of heat sinks are of various varieties, among them, the most and widely used heat sink is aluminium heatsink due to its excellent advantages.
Electric Heating Radiator
The home heating radiator is a kind of terminal equipment for home heating, and the heat source is generally home wall-hung boilers for the cities central heating, district by heat conduction, through radiation and convection to give the heat out, so that the temperature of the room can be enhanced. Heating radiator on the market from the material is basically divided into brass aluminum wings convection radiator, steel radiator, aluminum radiators, copper radiators, stainless steel radiators, copper and aluminum composite radiator and the original cast iron radiators
Computer Heatsink
Computer components have extensive use of integrated circuits. As we all know, the high temperature is the enemy of integrated circuits. The high temperature will not only lead to instability in the system is running, life shortening, and it may even make some parts burned. Causing the high temperature of the heat does not come from the computer, but come from the inside of the computer, or is within the integrated circuit. The role of the radiator is heat absorption, and then it diverges to the chassis, to ensure the normal temperature of the computer components. That radiator through contact and the surface of the heat-generating member to absorb heat, again by a variety of methods to deliver heat to the distant, such as the air within the cabinet, and then the chassis these hot air transmitted to the outside of the chassis, the completion of the cooling of the computer. The radiator cannot be mixed, which most contact with the CPU chipset heatsink. In accordance with the heat away from the radiator, the radiator can be divided into active cooling and passive cooling. The former common air-cooled radiator, while the latter is common heatsink. According to the further subdivided cooling mode, it can be divided into air-cooled heat pipes, liquid cooling and semiconductor refrigeration compressor refrigeration.
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